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> It turns out that soldering parts in place makes them less likely

You've obvious never heard of MBP BGA chip solder ball cracking and rendering the whole device useless...



I didn’t say they never failed. Just that they fail less frequently.

In any case, solder ball cracking results from process issues and is a solved problem: https://www.pcbcart.com/article/content/reasons-for-cracks-i...

Certain not something that would be improved with sockets.




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