A chip can contain multiple dies.
Usually chips were just discrete packages basically a die that is packaged for integration onto a PCB.
A die is just the bare silicon that has an IC etched into it.
With interposers and modern multi chip packages things are a bit more complicated.
Since the RAM dies are packages they themselves can be defined as chips too while the CPU needs to be integrated to the substrate first.
At this point it’s a question is the CPU+RAM combo can be defined as a chip on its own or is it a hybrid/compound package I would go with the latter.
If the memory and cpu dies / chips would’ve been stacked like say the raspberry pie one I would call it RAM on chip tho.
A chip can contain multiple dies.
Usually chips were just discrete packages basically a die that is packaged for integration onto a PCB.
A die is just the bare silicon that has an IC etched into it.
With interposers and modern multi chip packages things are a bit more complicated.
Since the RAM dies are packages they themselves can be defined as chips too while the CPU needs to be integrated to the substrate first.
At this point it’s a question is the CPU+RAM combo can be defined as a chip on its own or is it a hybrid/compound package I would go with the latter.
If the memory and cpu dies / chips would’ve been stacked like say the raspberry pie one I would call it RAM on chip tho.